Address
Dep. of Semiconductor Engineering, POSTECH 77,
Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea
(37673)
TEL: +82-54-279-7085
E-mail: daehwankang@postech.ac.kr
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Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL)
All rights reserved | Designed by greypixel
Address
Dep. of Semiconductor Engineering, POSTECH 77, Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea (37673)
TEL: +82-54-279-7085
E-mail: daehwankang@postech.ac.kr
Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel
Soo-Hyun Kim, Ki-Tae Kim, Arindom Datta, Hyun-Mi Kim, Ki-Bum Kim, Dae-Hwan Kang, “Multilayer diffusion barrier for copper metallization using a thin interlayer metal (M=Ru, Cr, and Zr) between two TiN films”, J. Vac. Sci. Technol. vol. B 21, no. 2, p. 804 (2003).