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“Atomic-layer-deposited WNxCy thin films as diffusion barrier for copper metallization”

2023-08-24
조회수 161

Soo-Hyun Kim, Su Suk Oh, Ki-Bum Kim, Dae-Hwan Kang, Wei-Min Li, Suvi Haukka, and Marko Tuominen, “Atomic-layer-deposited WNxCy thin films as diffusion barrier for copper metallization”, Appl. Phys. Lett. vol. 82, p. 4486 (2003).


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Address

Dep. of Semiconductor Engineering, POSTECH 77,

Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea

(37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr



Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL)

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Address

Dep. of Semiconductor Engineering, POSTECH 77, Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea (37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr


Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel