2011 Paper 6
2023-08-24
조회 42

Tae-Ho Kim, Tae-Kwang Eom, Soo-Hyun Kim, Dae-Hwan Kang, Hoon Kim, Sangho Yu, and Jin Mook Lim “Plasma-enhanced atomic layer deposition of TaCx films using tris(neopentyl) tantalum dichloride and H2 plasma” Electrochemical and Solid-State Letters, 14 (8) D89-D93 (2011).


2023-08-24
조회 48

Tae-Kwang Eom, Soo-Hyun Kim, Dae-Hwan Kang, and Hoon Kim, "Characteristics of plasma-enhanced atomic layer deposited RuSiN as a diffusion barrier against Cu" Journal of The Electrochemical Society Vol. 158, No. 11 D657-D663, 2011 (2011).

2023-08-24
조회 63

Sang-Hyeok Choi,Taehoon Cheon, Soo-Hyun Kim, Dae-Hwan Kang, Gye-Soon Park, and Sunjung Kim “Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating," Journal of The Electrochemical Society Vol.158, No.6 D351-D356, 2011 (2011)


2023-08-24
조회 52

Quanli Hu, Sung Mok Jung, Hyun Ho Lee, Yong-Sang Kim, Young Jin Choi, Dae-Hwan Kang, Ki-Bum Kim and Tae-Sik Yoon “Resistive switching characteristics of maghemite nanoparticle assembly” J. Phys. D: Appl. Phys. 44 (2011) 085403


2023-08-24
조회 69

Taehoon Cheon Sang-Hyeok Choi, Soo-Hyun Kim and Dae-Hwan Kang “Atomic layer deposition of RuAlO thin films as a diffusion barrier for seedless Cu interconnects” 8 March 2011, Electrochemical and Solid-State Letters Vol.14, No.5, D57-D61 (2011).


2023-08-24
조회 46

Junsoo Bae, Kyuman Hwang, Kwangho Park, Seongbu Jeon, Dae-Hwan Kang, Soonoh Park, Juhyeon Ahn, Seoksik Kim, Gitae Jeong, and Chilhee Chung, “Microstructural Characterization in Reliablity Measurement of Phase Change Random Access Memory” Jpn. J. Appl. Phys. 50(4), , 2011p. 04DD12 (2011).  


Address

Dep. of Semiconductor Engineering, POSTECH 77,

Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea

(37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr



Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL)

All rights reserved | Designed by greypixel



Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel