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“Atomic layer deposition of RuAlO thin films as a diffusion barrier for seedless Cu interconnects”

2023-08-24
조회수 194

Taehoon Cheon Sang-Hyeok Choi, Soo-Hyun Kim and Dae-Hwan Kang “Atomic layer deposition of RuAlO thin films as a diffusion barrier for seedless Cu interconnects” 8 March 2011, Electrochemical and Solid-State Letters Vol.14, No.5, D57-D61 (2011).


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Address

Dep. of Semiconductor Engineering, POSTECH 77,

Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea

(37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr



Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL)

All rights reserved | Designed by greypixel


Address

Dep. of Semiconductor Engineering, POSTECH 77, Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea (37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr


Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel