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“Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating,"

2023-08-24
조회수 375

Sang-Hyeok Choi,Taehoon Cheon, Soo-Hyun Kim, Dae-Hwan Kang, Gye-Soon Park, and Sunjung Kim “Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating," Journal of The Electrochemical Society Vol.158, No.6 D351-D356, 2011 (2011)


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Address

Dep. of Semiconductor Engineering, POSTECH 77,

Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea

(37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr



Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL)

All rights reserved | Designed by greypixel


Address

Dep. of Semiconductor Engineering, POSTECH 77, Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea (37673)


TEL: +82-54-279-7085

E-mail: daehwankang@postech.ac.kr


Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel